徐骏, 徐建芳, 周卫东. 制样方法对固体粉末X射线光电子能谱测试结果的影响[J]. 分析测试技术与仪器, 2021, 27(4): 278-285. DOI: 10.16495/j.1006-3757.2021.04.007
引用本文: 徐骏, 徐建芳, 周卫东. 制样方法对固体粉末X射线光电子能谱测试结果的影响[J]. 分析测试技术与仪器, 2021, 27(4): 278-285. DOI: 10.16495/j.1006-3757.2021.04.007
XU Jun, XU Jian-fang, ZHOU Wei-dong. Effect of Sample Preparation Methods on X-ray Photoelectron Spectroscopic Testing Results of Solid Powder[J]. Analysis and Testing Technology and Instruments, 2021, 27(4): 278-285. DOI: 10.16495/j.1006-3757.2021.04.007
Citation: XU Jun, XU Jian-fang, ZHOU Wei-dong. Effect of Sample Preparation Methods on X-ray Photoelectron Spectroscopic Testing Results of Solid Powder[J]. Analysis and Testing Technology and Instruments, 2021, 27(4): 278-285. DOI: 10.16495/j.1006-3757.2021.04.007

制样方法对固体粉末X射线光电子能谱测试结果的影响

Effect of Sample Preparation Methods on X-ray Photoelectron Spectroscopic Testing Results of Solid Powder

  • 摘要: 为了得到准确且分辨率高的X射线光电子能谱(XPS)数据,采用不同制样方法对不同类型的导电、不导电和混合粉末的测试结果进行了研究. 从图谱半峰宽、是否有荷电、真实性、制样效率和数据处理等方面阐述不同制样方法对测试结果的影响. 试验结果表明,对于导电和不导电粉末,粘取制样略优于铟片制样,其中使用碳导电胶带制样效果更好. 对于混合样品,Scotch双面胶带粘样后的测试结果优于其他3种制样方式. 此外,铟片制样可作为数据处理时荷电校正的参考方法.

     

    Abstract: In order to obtain accurate and high-resolution X-ray photoelectron spectroscopic (XPS) data, different sample preparation methods were used to study the XPS testing results of different types of conductive powders, non-conductive powders and mixed powders. The effect of different sample preparation methods on testing results were discussed from the aspects of half-peak width, charge, authenticity, sample preparation efficiency and data processing. The results showed that the adhesive sample preparation was better than the indium chip sample preparation for conductive powders and non-conductive powders, and the carbon conductive tape was better. For mixed samples, the results of Scotch double-sided tape were better than those of the other three sample preparation methods. In addition, the indium chip sample preparation can be used as a reference method for the charge correction in data processing.

     

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