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庄立波,包生祥,汪蓉,张琳. 基于SEM的MLCC端电极焊接失效分析[J]. 分析测试技术与仪器, 2009, 15(1).
引用本文: 庄立波,包生祥,汪蓉,张琳. 基于SEM的MLCC端电极焊接失效分析[J]. 分析测试技术与仪器, 2009, 15(1).
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ZHUANG Li-bo1,BAO Sheng-xiang1,WANG Rong2,ZHANG Lin2. Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM[J]. Analysis and Testing Technology and Instruments, 2009, 15(1).
Citation: ZHUANG Li-bo1,BAO Sheng-xiang1,WANG Rong2,ZHANG Lin2. Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM[J]. Analysis and Testing Technology and Instruments, 2009, 15(1).
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基于SEM的MLCC端电极焊接失效分析

Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM

    摘要
  • 摘要: 针对多层陶瓷电容器端电极锡镀层的可焊性失效问题,运用扫描电子显微镜(SEM)分析了锡镀层的微观结构,并用能谱仪对其进行成分分析,找出了失效的主要原因:可焊性变差样品的端电极表面锡镀层出现因氧化产生的异常区域,以至于器件的可焊性变差.并通过后期的可焊性实验验证了分析的结果,找出了端电极焊接失效的原因,并提出了应对端电极氧化问题的改进措施.根据分析提出了改进意见,较好地解决了器件的焊接失效问题.

     

    Abstract: Aimed at the problem of welding failure of tin-coating in multilayer ceramic capacitors devices,we studied the microstructure and components of tin-coating with SEM and EDS.The welding failure modes occurred in the outer-electrode are demonstrated and the reason of failure are discussed.The results show that some abnormal regions on the tin-coating of samples with welding problem are produced by oxidation.The strict solderability test has verified the results of the analysis and according to the analysis im...

     

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