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冯善娥, 高伟建, 陈木子. 扫描电镜在多晶硅电池片焊带分析中的应用[J]. 分析测试技术与仪器, 2013, 19(2): 114-117.
引用本文: 冯善娥, 高伟建, 陈木子. 扫描电镜在多晶硅电池片焊带分析中的应用[J]. 分析测试技术与仪器, 2013, 19(2): 114-117.
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FENG Shan-e, GAO Wei-jian, CHEN Mu-zi. Application of Scanning Electron Microscope in Analysis of Polysilicon Cell Welding Zone[J]. Analysis and Testing Technology and Instruments, 2013, 19(2): 114-117.
Citation: FENG Shan-e, GAO Wei-jian, CHEN Mu-zi. Application of Scanning Electron Microscope in Analysis of Polysilicon Cell Welding Zone[J]. Analysis and Testing Technology and Instruments, 2013, 19(2): 114-117.
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扫描电镜在多晶硅电池片焊带分析中的应用

Application of Scanning Electron Microscope in Analysis of Polysilicon Cell Welding Zone

    摘要
  • 摘要: 对多晶硅电池片焊带接口进行金相包埋,利用扫描电镜(SEM)表征,观察焊带与硅片结合处的图像及其成分分布,进而了解焊接情况,为工艺优化提供技术支撑.

     

    Abstract: The feature and composition distribution of the polysilicon cell welding zone, which is metallographically embedded, and silicon wafer is characterized by scanning electron microscopy to understand the welding condition, thus technical support is provided for the optimization of the process.

     

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