章小余, 赵志娟, 刘芬, 徐鹏, 屈宝龙. 基于X射线光电子能谱的绝缘栅双极型晶体管失效分析[J]. 分析测试技术与仪器, 2023, 29(4): 352-356. DOI: 10.16495/j.1006-3757.2023.04.003
引用本文: 章小余, 赵志娟, 刘芬, 徐鹏, 屈宝龙. 基于X射线光电子能谱的绝缘栅双极型晶体管失效分析[J]. 分析测试技术与仪器, 2023, 29(4): 352-356. DOI: 10.16495/j.1006-3757.2023.04.003
ZHANG Xiaoyu, ZHAO Zhijuan, LIU Fen, XU Peng, QU Baolong. Failure Analysis of Insulated Gate Bipolar Transistors Based on X-ray Photoelectron Spectrometer[J]. Analysis and Testing Technology and Instruments, 2023, 29(4): 352-356. DOI: 10.16495/j.1006-3757.2023.04.003
Citation: ZHANG Xiaoyu, ZHAO Zhijuan, LIU Fen, XU Peng, QU Baolong. Failure Analysis of Insulated Gate Bipolar Transistors Based on X-ray Photoelectron Spectrometer[J]. Analysis and Testing Technology and Instruments, 2023, 29(4): 352-356. DOI: 10.16495/j.1006-3757.2023.04.003

基于X射线光电子能谱的绝缘栅双极型晶体管失效分析

Failure Analysis of Insulated Gate Bipolar Transistors Based on X-ray Photoelectron Spectrometer

  • 摘要: 绝缘栅双极晶体管(IGBT)作为功率变流器的核心器件,其稳定状态在一定程度上决定了整个功率变流器的可靠性. 国内某公司生产的一款IGBT模块在使用中出现过电压应力失效而被击穿,将其拆封后发现模块内部存在黑色枝状物,采用X射线光电子能谱法(XPS)对其进行失效分析,发现黑色枝状物的组成为金属硫化物及硫酸盐. 通过元素定性、定量与化学态分析为模块实际应用中的失效机制提供了科学指导. 进一步结合XPS数据结果详细分析了可能的硫物种污染来源,并针对器件封装材料和使用环境提出了改进和预防措施.

     

    Abstract: As the key device of power converter, the stability of insulated gate bipolar transistors (IGBT) can determine the reliability of the entire power converter to a certain extent. An IGBT module produced by a domestic company was broken down due to overvoltage stress failure in use, and some black dendrites were found in the unpacking module. The X-ray photoelectron spectrometer (XPS) was used to analyze the device failure. It was found that the black dendrites were composed of metal sulfides and sulfates. Through qualitative, quantitative and chemical state analysis of elements, some scientific guidances for the failure mechanism in the practical application of modules were provided. The possible sources of sulfur species pollution were analyzed in detail based on XPS data, while some improvements and prevention measures for device packaging materials and application environment were proposed.

     

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