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郑建明. 同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银[J]. 分析测试技术与仪器, 2009, 15(3).
引用本文: 郑建明. 同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银[J]. 分析测试技术与仪器, 2009, 15(3).
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ZHENG Jian-ming. Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES[J]. Analysis and Testing Technology and Instruments, 2009, 15(3).
Citation: ZHENG Jian-ming. Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES[J]. Analysis and Testing Technology and Instruments, 2009, 15(3).
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同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银

Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES

    摘要
  • 摘要: 提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法.合金样品经2 g酒石酸和8 mL稀硝酸溶解后,用电感耦合等离子发射光谱仪法(ICP-AES)同时测定溶液中的锡和银.回收率为98%～102%,RSD为0.9%～2.1%.

     

    Abstract: A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.The sample was dissolved with 2 g of tartaric acid and 8 mL of nitric acid,tin and silver were simultancously determined by ICP-AES.The recoveries of the elements were in the range of 98%~102%,and the RSD,0.9%~2.1%.

     

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