Simultaneous Determination of Ag, P and Sn in Copper Alloy by Inductively Coupled Plasma Atomic Emission Spectrometry

A method for the simultaneously determined of Ag, P and Sn in copper-based solder of low silver was developed using inductively coupled plasma atomic emission spectrometry(ICP-AES)with Ag 328.0 nm, P 178.2 nm, Sn 189.9 nm as analysis lines.The samples were dissolved in aqua regia solution. Under the selected experimental conditions, the detection limit of the method was 0.002 4%~0.004 8% (mass fraction), all the linear correlation coefficients of calibration curves of each element were greater than 0.999 5. According to the test method, the recovery of standard addition was 95%~103%, and the relative standard deviation (RSD, n=10) of the results was less than 5%.